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NXP
查看可供型号、数据手册并快速获取报价。
| 型号 | 厂商 | 封装 | 库存 | 数据手册 | 获取报价 |
| TDA8932BTW/N2,118 | NXP USA Inc. | 32-TSSOP (0.240", 6.10mm Width) Exposed Pad | 1147 | 获取报价 | |
| TDA8922BJ/N2,112 | NXP USA Inc. | 23-SIP Formed Leads | 1041 | 获取报价 | |
| TDA8920CJ/N1,112 | NXP USA Inc. | 23-SIP Formed Leads | 1126 | 获取报价 | |
| TDA8920BJ/N2,112 | NXP USA Inc. | 23-SIP Formed Leads | 2046 | 获取报价 | |
| TDA8922BTH/N2,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 2606 | 获取报价 | |
| TDA8922CTH/N1,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 1815 | 获取报价 | |
| TDA1566TH/N2S,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 3191 | 获取报价 | |
| TDA8920BTH/N2,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 1043 | 获取报价 | |
| TDF8548ATH/N1ZU | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 3579 | - | 获取报价 |
| TDF8548ATH/N1ZJ | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 4963 | - | 获取报价 |
| TDA8950TH/N1,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 2147 | 获取报价 | |
| TDF8546TH/N2,118 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 2684 | 获取报价 | |
| TDA8953TH/N1,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 3484 | 获取报价 | |
| TDF8590TH/N1TJ | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 3118 | 获取报价 | |
| TDA8954TH/N1,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 4568 | 获取报价 | |
| TDA8920TH/N1,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 1542 | 获取报价 | |
| TDA8924TH/N2,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 3506 | 获取报价 | |
| TDA8920CTH/N1,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 4769 | 获取报价 | |
| TDF8599BTH/N1,512 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 3494 | 获取报价 | |
| TDF8599BTH/N1,518 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 3966 | 获取报价 | |
| TDA8594J/N1 | NXP USA Inc. | 27-SIP, Formed Leads | 1063 | 获取报价 | |
| TDF8541TH/N2,518 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 1162 | - | 获取报价 |
| TDF8599ATH/N2,512 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 2449 | 获取报价 | |
| TDF8599ATH/N2,518 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 2385 | 获取报价 | |
| TDF8541TH/N3,118 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 4664 | - | 获取报价 |
| TDF8544TH/N3,118 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 4133 | - | 获取报价 |
| TDF8541JS/N3,512 | NXP USA Inc. | 27-PowerSMD Module | 1675 | 获取报价 | |
| TDF8541SD/N3,112 | NXP USA Inc. | 27-SIP Formed Leads | 2975 | - | 获取报价 |
| TDF8544J/N3,112 | NXP USA Inc. | 27-SIP, Formed Leads | 4851 | - | 获取报价 |
| TDF8544SD/N3,112 | NXP USA Inc. | 27-SIP Formed Leads | 2330 | - | 获取报价 |
