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NXP
查看可供型号、数据手册并快速获取报价。
| 型号 | 厂商 | 封装 | 库存 | 数据手册 | 获取报价 |
| TDF8599TD/N2,518 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 2204 | - | 获取报价 |
| TDF8599TH/N2,518 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 2662 | - | 获取报价 |
| TDA8933BTW/N2,112 | NXP USA Inc. | 32-TSSOP (0.240", 6.10mm Width) Exposed Pad | 2355 | 获取报价 | |
| TDA8933BTW/N2,118 | NXP USA Inc. | 32-TSSOP (0.240", 6.10mm Width) Exposed Pad | 4237 | 获取报价 | |
| TDA8922CJ/N1,112 | NXP USA Inc. | 23-SIP Formed Leads | 1121 | 获取报价 | |
| TDA8922CTH/N1,112 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 3892 | 获取报价 | |
| TDA8954J/N1,112 | NXP USA Inc. | 23-SIP Formed Leads | 3100 | 获取报价 | |
| TDF8590TH/N1S,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 2825 | 获取报价 | |
| TDA8566Q/N2S,112 | NXP USA Inc. | 17-SIP Formed Leads | 3824 | 获取报价 | |
| TDA8569Q/N1S,112 | NXP USA Inc. | 23-SIP Formed Leads | 1648 | 获取报价 | |
| TDA8566TH/N2S,112 | NXP USA Inc. | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 3767 | 获取报价 | |
| TDA8566TH/N2S,118 | NXP USA Inc. | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 4893 | 获取报价 | |
| TDA8561Q/N3S,112 | NXP USA Inc. | 17-SIP Formed Leads | 4161 | 获取报价 | |
| TDA8567Q/N3S,112 | NXP USA Inc. | 23-SIP Formed Leads | 1130 | 获取报价 | |
| TDA8571J/N2S,112 | NXP USA Inc. | 23-SIP Formed Leads | 4167 | 获取报价 | |
| TDA8953J/N1,112 | NXP USA Inc. | 23-SIP Formed Leads | 3043 | 获取报价 | |
| TDA8953TH/N1,112 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 1627 | 获取报价 | |
| TDA8595J/N2S,112 | NXP USA Inc. | 27-SIP, Formed Leads | 2008 | 获取报价 | |
| TDA8566TH1/N2S,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 3376 | 获取报价 | |
| TDA8594SD/N1S,112 | NXP USA Inc. | 27-SIP Formed Leads | 4646 | 获取报价 | |
| TDA8595TH/N2S,112 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 4104 | 获取报价 | |
| TDA8595TH/N2S,118 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 1583 | 获取报价 | |
| TDF8591TH/N1S,118 | NXP USA Inc. | 24-BSOP (0.433", 11.00mm Width) Exposed Pad | 2601 | 获取报价 | |
| TDF8530TH/N1,518 | NXP USA Inc. | 44-BSSOP (0.433", 11.00mm Width) Exposed Pad | 4331 | 获取报价 | |
| TDF8546TH/N1,518 | NXP USA Inc. | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | 1564 | 获取报价 | |
| TDF8530TH/N1,512 | NXP USA Inc. | 44-BSSOP (0.433", 11.00mm Width) Exposed Pad | 1830 | 获取报价 | |
| TDF8541J/N2,112 | NXP USA Inc. | 27-SIP, Formed Leads | 3456 | - | 获取报价 |
| TDF8541SD/N2,112 | NXP USA Inc. | 27-SIP Formed Leads | 2793 | - | 获取报价 |
| SA58635UK,027 | NXP USA Inc. | 16-UFBGA, WLCSP | 2594 | 获取报价 | |
| TDA8595SD/N2S,112 | NXP USA Inc. | - | 1625 | 获取报价 |
